Microducts bundles - new at SPUR a.s. company
Multiducts bundles are mostly designated for more effective FTTH deployment.
Multi DB bundles of thick walled microducts(optional configurations) have high crush resistence and so can be directly buried into the ground without any protection. Thin jacket allows easy access to individual microducts, followed branching and lead to accessories savings.
 |
Multi DI bundles of thin walled microducts (optional configurations) with thin jacket (on the base of LDPE) need to have extra protection. Therefore are mostly pulled into pre-installed subducts.
-
SPUR a.s.
Specialized plastic products, piping systems, cable protectors, insulating materials made of polyethylene foam, packaging material, bubble wrap,...
Dronetag – 3D printing of cases for remote identification of drones from cotu s.r.o.
28.4.2025 The case study of the Dronetag company brings us a detailed look at the use of 3D printing in the production of remote identification cases for drones, which is the key to safe and regulated operation in the airspace.
