ARBURG at Chinaplas 2014

ARBURG will be demonstrating high-end injection molding technology live at the Chinaplas in Shanghai from April 23 to 26 2014.

The three exhibits to be shown on stand E1G01 are precisely tailored to the needs of the key industries for Asia – packaging and electronics.

ARBURG presence at leading plastics trade fair in Asia
“Our modular ALLROUNDER injection molding machines can be equipped for specific applications or industries. We will be showing sophisticated examples of this at the Chinaplas 2014, with the production of high-quality IML packaging as well as the Hotmelt process,” says Zhao Tong, Managing Director of the ARBURG subsidiary in Shanghai. “The Asian market increasingly demands solutions that are characterized by high performance, automation and customization and that can be made available quickly,” adds Max Man, Managing Director of the ARBURG subsidiaries in Shenzhen and Hong Kong. “We offer our customers all of this, plus comprehensive pre- and after-sales service.”

Packaging versions of high-speed, high-performance machines
The electric and hybrid ALLDRIVE and HIDRIVE machines in the new Packaging (P) version combine high productivity and reduced energy requirements. They thus meet the stringent requirements for the production of mass-produced items for the packaging industry. At the Chinaplas 2014, a production cell will produce four high-quality IML tubs in a cycle time of only around 2.75 seconds.

Electronics: Hotmelt process protects against splash water
In the Hotmelt process, electronic components are encapsulated with adhesive to produce a perfect watertight seal with low mold cavity pressures. This will be demonstrated on a vertical ALLROUNDER 275 V, which will be used to produce an LED carrier.

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