Microducts bundles - new at SPUR a.s. company
Multiducts bundles are mostly designated for more effective FTTH deployment.
Multi DB bundles of thick walled microducts(optional configurations) have high crush resistence and so can be directly buried into the ground without any protection. Thin jacket allows easy access to individual microducts, followed branching and lead to accessories savings.
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Multi DI bundles of thin walled microducts (optional configurations) with thin jacket (on the base of LDPE) need to have extra protection. Therefore are mostly pulled into pre-installed subducts.
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SPUR a.s.
Specialized plastic products, piping systems, cable protectors, insulating materials made of polyethylene foam, packaging material, bubble wrap,...
Slovak Plastics Cluster celebrated its 16th anniversary with the General Assembly
16.4.2025 Members and invited guests of the Slovak Plastics Cluster met on 10.4.2025 in the beautiful premises of the Auto JAS Hotel in Nitra for an ordinary meeting of the General Assembly. The main item on the agenda was the presentation of the annual...